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Troubleshooting Methods

Because several different structured troubleshooting methods exist, choosing the appropriate one for solving a reported problem is essential. This will shorten the time and help you solve the problem more effectively. The most commonly used troubleshooting methods are:

  • Top-down: This method starts from the application layer in the Open Systems Interconnect (OSI) model and moves down to the physical layer. It is recommended when the potential cause is software or application based. For example, the Windows OS made an update, and the user started experiencing problems afterward.
  • Bottom-up: This method is the opposite of the top-down method and starts from the physical layer in the OSI model and moves up to the application layer. It is perfectly suited for situations where a physical cause might be the reason for the reported problem, such as cabling replacements or adding new devices.
  • Divide and conquer: One of the most popular methods among troubleshooters. It starts in the middle of the OSI model, on the network layer. It is based on performing a ping, and depending on the result, the troubleshooting process focuses on the layers above or below. 
  • Follow the path: This method focuses on the path the packets take when traveling throughout the network. This method can be very useful in scenarios where the network is complex and consists of many devices. Performing a traceroute will find the device causing the problem because the traceroute will stop there. 
  • Perform comparison: Sometimes, devices can have similar configurations, which can be used as an advantage in certain troubleshooting scenarios. By comparing the configuration on the device that has the problem with the configuration of a fully functional device, you can easily find the missing commands or any misconfiguration that has been done.   
  • Swap components: In some rare situations, the device's hardware could be the reason for the reported problem. Although it is very unlikely to happen, it is still possible for the RAM or the flash drive to fail occasionally.